Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine

Product Details
Customization: Available
After-sales Service: Video Technical Support
Condition: New
Diamond Member Since 2021

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Overview

Basic Info.

Model NO.
CB832
Speed
High Speed
Precision
High Precision
Certification
CCC, PSE, FDA, RoHS, ISO, CE
Warranty
6 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Delivery
1-7 Days
MOQ
1 PC
Quality
100% Tested
Adaptation
SMT Placement Machine
Inventory
Availability
Transport Package
Plastic Bag&Carton Box
Specification
1700 KG
Trademark
CLIP
Origin
Germany
HS Code
8479896200
Production Capacity
5PCS/Year

Product Description

Product Description
 

The high-precision fully automatic die bonder CB832 Plus is an automated high-precision die bonder with the following main features and functions:

High-precision positioning: CB832 has patented perspective image recognition technology, which can achieve an XY positioning accuracy of ±3 µm@3σ.

Multiple material handling capabilities: The device supports multiple material handling, including wafers on expanders or clamping rings, optional format trays, Gelpak, tape feeders, etc.

Traceability: Improve product traceability through barcodes, QR codes or OCR technology on panels/wafers/chips.

Die bond force control: Equipped with a die bond force sensor, the die bond force can be accurately controlled.

Fast UV curing: Supports spot curing and panel curing, suitable for applications such as PCB/COB transceiver packaging.

Applicable fields and industries

CB832 is suitable for IC packaging equipment, especially for advanced packaging. It is widely used in semiconductor manufacturing and packaging processes, and can significantly improve packaging efficiency and yield.

 
Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine
 
 

 
Packaging & Shipping
All goods packed with wooden case package, vacuum packaging, PE film packing, carton packing and other combinations ,
Ensure that all goods would not be damaged during transportation.
Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine
Related Products

Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine

Company Information:

                                                                                            COMPANY PROFILE
 
Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine
WHY CHOOSE US?

Guangdong Xinling Industrial Co., Ltd. is an innovative technology enterprise whose main business is the full-chain intelligent service of chip mounter equipment. We are based in Shenzhen, the core city of the Guangdong-Hong Kong-Macao Greater Bay Area, and have worked hard for more than ten years. Xinling Industry has always adhered to the development concept of "co-leading with science and technology, co-developing with talents, and creating value for customers" to innovate with technology Based on the foundation, professional team as the core, and high-quality service as the guarantee, we will dig deep into the industry pain points and user needs in the field of global placement machines, and continue to tirelessly explore in more professional market segments and cutting-edge technological innovation fields.
Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine

Our advantage

1st,We have strict inspection standards for the quality of our products, which has formed a high-standard process system;

2nd,We have a strong price advantage, absolute price advantage is the best choice for customers;

3rd, our business philosophy: "Customer first, Quality first " Principle;

4th, We are a big international brand level agents and over the years we accumulated a high quality customer resources;

5th, We have a global sourcing, huge demand we can reduce the purchase cost. More new accessories supply to ensure our sustainable supply and price advantage.

Successful Experience:
Xlin's customer in 30 countries around the world
We have been helping customers to build a lot of new factories around the world.
We hope Became the most reliable Chinese partner for you.
Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine

COOPERATION BRAND

Semiconductor Equipment Bonder CB832 Manufacturers Asmpt Clip Fully Automatic Die Bonding Machine

 
FAQ

1. What products can you provide? 
Placement Machine Feeder, SMT Placement Machine, SMT AOI, SMT SPI, SMT Stencil Printer, SMT Reflow Oven, SMT X-Ray, SMT Feeder, SMT Nozzle, LED Pick & Place Machine, Wave Soldering Machine, SMT Coating Machine, SMT Cleaning Machine, SMT Label Mounter, PCB Cutting Machine, PCB Laser Printer Machine, PCB Handling Machine, SMT Mounter Sales: Placement Machine, Placement Machine Accessories, SMT Accessories.


2. Can I get a sample? what is your MOQ?
Yes, sample is available, our MOQ is 1 piece 


3. How long will it take to deliver the goods?
About 1 to 7 working days. 

4. What kinds of brands of parts can you provide? 
We have Fuji, Juki, Yamaha, Samsung, Panaconic, Siemens, Universal, Hitachi etc.


5. What is the warranty of feeders?
We provide 6 months` warranty on new feeders and 3 months on Second hand Feeders, actual life depends on working and maintanance. If feeder can not work after newly received , free repalcement would be sent immediately or refund
 

After Sales Service

                            24 hrs online, quick response, guaranteed warranty for you :))
                                 For more information, please visit our Official website
                                             
https://gdxinling.en.made-in-china.com 

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