Asm Small Semiconductor Die Bonding Machine Ad800

Product Details
Customization: Available
After-sales Service: Video Technical Support
Condition: New
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Overview

Basic Info.

Model NO.
AD800
Speed
High Speed
Precision
High Precision
Certification
CCC, PSE, FDA, RoHS, ISO, CE
Warranty
6 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Delivery
1-7 Days
MOQ
1 Set
Quality
100% Tested
Adaptation
SMT Placement Machine
Inventory
Available
Transport Package
Plastic Bag&Carton Box
Specification
2100 KG
Trademark
ASM
Origin
Germany
HS Code
8479896200
Production Capacity
500PCS/Year

Product Description

Product Description
 

ASM die bonding machine AD800 is a high-performance, fully automatic die bonding machine with many advanced functions and features. The following is its detailed introduction:

Main features

Ultra-high-speed operation: The cycle time of the AD800 die bonding machine is 50 milliseconds, which significantly improves production efficiency.

High-precision positioning: XY position accuracy is ±25 microns, and mold rotation accuracy is ±3 degrees, ensuring high-precision die bonding operations.

Wide Application Range: Able to handle small molds (as low as 3 mil) and large substrates (up to 270 x 100 mm), suitable for a variety of application scenarios.

Comprehensive quality inspection: Equipped with defect inspection, comprehensive quality inspection functions before and after bonding to ensure product quality.

Automated functions: Automatically skip units and molds, inking or poor quality functions, and inspection functions before and after bonding, further improving production efficiency and product quality.

Energy-saving design: Using linear motor design, it reduces maintenance costs and has the characteristics of energy saving and low power consumption.

High production efficiency: High UPH (output per hour) and occupancy ratio improve the utilization of factory space.

Technical parameters

Dimensions: Width, depth and height 1570 x 1160 x 2057 mm.

Application scenarios

AD800 die bonding machine is suitable for various application scenarios of chip packaging equipment, especially in the field of semiconductor packaging. It can handle multiple types of substrates and molds to meet different production needs.


Asm Small Semiconductor Die Bonding Machine Ad800

 
Packaging & Shipping
All goods packed with wooden case package, vacuum packaging, PE film packing, carton packing and other combinations ,
Ensure that all goods would not be damaged during transportation.
Asm Small Semiconductor Die Bonding Machine Ad800
Related Products

Asm Small Semiconductor Die Bonding Machine Ad800

Company Information:

                                                                                            COMPANY PROFILE
 
Asm Small Semiconductor Die Bonding Machine Ad800
WHY CHOOSE US?

Guangdong Xinling Industrial Co., Ltd. is a high-end brand manufacturer of fully automatic AOI visual inspection equipment, which integrates research and development, manufacturing, sales and service. 
and we are the leading SMT machines and solution with 10 years' experience in China. and we are aslo the only Chinese SMT supplier for ASM factory in China.
Asm Small Semiconductor Die Bonding Machine Ad800

Our advantage

1st,We have strict inspection standards for the quality of our products, which has formed a high-standard process system;

2nd,We have a strong price advantage, absolute price advantage is the best choice for customers;

3rd, our business philosophy: "Customer first, Quality first " Principle;

4th, We are a big international brand level agents and over the years we accumulated a high quality customer resources;

5th, We have a global sourcing, huge demand we can reduce the purchase cost. More new accessories supply to ensure our sustainable supply and price advantage.

Successful Experience:
Xlin's customer in 30 countries around the world
We have been helping customers to build a lot of new factories around the world.
We hope Became the most reliable Chinese partner for you.
Asm Small Semiconductor Die Bonding Machine Ad800

COOPERATION BRAND

Asm Small Semiconductor Die Bonding Machine Ad800

 
FAQ

1. What products can you provide? 
Placement Machine Feeder, SMT Placement Machine, SMT AOI, SMT SPI, SMT Stencil Printer, SMT Reflow Oven, SMT X-Ray, SMT Feeder, SMT Nozzle, LED Pick & Place Machine, Wave Soldering Machine, SMT Coating Machine, SMT Cleaning Machine, SMT Label Mounter, PCB Cutting Machine, PCB Laser Printer Machine, PCB Handling Machine, SMT Mounter Sales: Placement Machine, Placement Machine Accessories, SMT Accessories.


2. Can I get a sample? what is your MOQ?
Yes, sample is available, our MOQ is 1 piece 


3. How long will it take to deliver the goods?
About 1 to 7 working days. 

4. What kinds of brands of parts can you provide? 
We have Fuji, Juki, Yamaha, Samsung, Panaconic, Siemens, Universal, Hitachi etc.


5. What is the warranty of feeders?
We provide 6 months` warranty on new feeders and 3 months on Second hand Feeders, actual life depends on working and maintanance. If feeder can not work after newly received , free repalcement would be sent immediately or refund
 

After Sales Service

                            24 hrs online, quick response, guaranteed warranty for you :))
                                 For more information, please visit our Official website
                                             
https://gdxinling.en.made-in-china.com 

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