Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine

Product Details
Customization: Available
After-sales Service: Video Technical Support
Condition: New
Gold Member Since 2021

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  • Overview
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  • COOPERATION BRAND
  • FAQ
  • After Sales Service
Overview

Basic Info.

Model NO.
XP
Speed
High Speed
Precision
High Precision
Certification
CCC, PSE, FDA, RoHS, ISO, CE
Warranty
6 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Delivery
1-7 Days
MOQ
1 Set
Quality
100% Tested
Adaptation
SMT Placement Machine
Inventory
Available
Transport Package
Plastic Bag&Carton Box
Specification
2000 KG
Trademark
ASM
Origin
Germany
HS Code
8479896200
Production Capacity
2PCS/Year

Product Description

Product Description
 

The SIPLACE CA machine is a hybrid placement machine launched by ASMPT, which can realize both semiconductor flip chip (FC) and chip attachment (DA) processes on the same machine.

Technical specifications and performance parameters

The SIPLACE CA machine has a placement speed of up to 420,000 chips per hour, a resolution of 0.01mm, a number of feeders of 120, and a power supply requirement of 380V12. In addition, the SIPLACE CA2 has an accuracy of up to 10μm@3σ and a processing speed of 50,000 chips or 76,000 SMDs per hour.

Application areas and market positioning

The SIPLACE CA machine is particularly suitable for production environments that require high flexibility and powerful functions, such as automotive applications, 5G and 6G devices, smart devices, etc. By combining traditional SMT with bonding and flip chip assembly, SIPLACE CA improves the productivity of advanced packaging, maximizes flexibility, efficiency, productivity and quality, and saves a lot of time, cost and space.

Market and Technology Background

 Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine

As automotive applications, 5G and 6G, smart devices and many other devices require more compact and powerful components, advanced packaging has become one of the key technologies. SIPLACE CA machines create new opportunities for electronics manufacturers through their highly flexible configuration and streamlined processes, open up new markets and new customer groups, reduce costs and increase productivity.

In summary, SIPLACE CA machines are the ideal choice for electronics manufacturers with their high performance, high flexibility and powerful functions, especially in production environments that require high integration and advanced packaging

 
Packaging & Shipping
All goods packed with wooden case package, vacuum packaging, PE film packing, carton packing and other combinations ,
Ensure that all goods would not be damaged during transportation.
Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine
Related Products

Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine

Company Information:

                                                                                            COMPANY PROFILE
 
Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine
WHY CHOOSE US?

Guangdong Xinling Industrial Co., Ltd. is a high-end brand manufacturer of fully automatic AOI visual inspection equipment, which integrates research and development, manufacturing, sales and service. 
and we are the leading SMT machines and solution with 10 years' experience in China. and we are aslo the only Chinese SMT supplier for ASM factory in China.
Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine

Our advantage

1st,We have strict inspection standards for the quality of our products, which has formed a high-standard process system;

2nd,We have a strong price advantage, absolute price advantage is the best choice for customers;

3rd, our business philosophy: "Customer first, Quality first " Principle;

4th, We are a big international brand level agents and over the years we accumulated a high quality customer resources;

5th, We have a global sourcing, huge demand we can reduce the purchase cost. More new accessories supply to ensure our sustainable supply and price advantage.

Successful Experience:
Xlin's customer in 30 countries around the world
We have been helping customers to build a lot of new factories around the world.
We hope Became the most reliable Chinese partner for you.
Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine

COOPERATION BRAND

Semiconductor High Precision Plus Die Bonding and Flip Chip Placement Machine

 
FAQ

1. What products can you provide? 
Placement Machine Feeder, SMT Placement Machine, SMT AOI, SMT SPI, SMT Stencil Printer, SMT Reflow Oven, SMT X-Ray, SMT Feeder, SMT Nozzle, LED Pick & Place Machine, Wave Soldering Machine, SMT Coating Machine, SMT Cleaning Machine, SMT Label Mounter, PCB Cutting Machine, PCB Laser Printer Machine, PCB Handling Machine, SMT Mounter Sales: Placement Machine, Placement Machine Accessories, SMT Accessories.


2. Can I get a sample? what is your MOQ?
Yes, sample is available, our MOQ is 1 piece 


3. How long will it take to deliver the goods?
About 1 to 7 working days. 

4. What kinds of brands of parts can you provide? 
We have Fuji, Juki, Yamaha, Samsung, Panaconic, Siemens, Universal, Hitachi etc.


5. What is the warranty of feeders?
We provide 6 months` warranty on new feeders and 3 months on Second hand Feeders, actual life depends on working and maintanance. If feeder can not work after newly received , free repalcement would be sent immediately or refund
 

After Sales Service

                            24 hrs online, quick response, guaranteed warranty for you :))
                                 For more information, please visit our Official website
                                             
https://gdxinling.en.made-in-china.com 

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