Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine

Product Details
Customization: Available
After-sales Service: Video Technical Support
Condition: New
Gold Member Since 2021

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Overview

Basic Info.

Model NO.
AB383
Speed
High Speed
Precision
High Precision
Certification
CCC, PSE, FDA, RoHS, ISO, CE
Warranty
6 Months
Automatic Grade
Automatic
Type
High-speed Chip Mounter
Delivery
1-7 Days
MOQ
1 PC
Quality
100% Tested
Adaptation
SMT Placement Machine
Inventory
Availability
Transport Package
Plastic Bag&Carton Box
Specification
1700 KG
Trademark
ASMPT
Origin
Germany
HS Code
8479896200
Production Capacity
5PCS/Year

Product Description

Product Description

ASMPT fully automatic wire bonding machine AB383

The fully automatic wire bonding machine AB383 is a high-tech semiconductor manufacturing equipment, mainly used to realize the key step in the microelectronics process - wire bonding. Its equipment structure includes power supply, motion system, optical system, control system and auxiliary system. The power supply provides energy, the motion system drives the X, Y, and Z axes of the wire bonding machine to move precisely, the optical system provides light source, the control system operates as a whole through the central processor, and the auxiliary system includes cooling, pneumatic and sensor systems, etc., to provide necessary support and guarantee for the equipment.

Working principle

The working principle of the AB383 wire bonding machine mainly includes the following steps:

Positioning: Move the wire bonding head to the specified position through the motion system.

Optical positioning: Position the two objects to be welded through the optical system.

Precise control: The control system performs precise control to align the wire bonding head with the two objects to be welded.

Welding: Provide energy through the power supply to connect the wire bonding wire to the two objects.

Advantages and application scenarios

The advantages of the AB383 wire bonding machine are its accuracy, stability and high efficiency. Its precise positioning and welding technology can ensure accurate welding of tiny objects, and its efficient workflow can improve production efficiency. Its main application scenarios include integrated circuit manufacturing, solar cell manufacturing, LED manufacturing and other fields that require micron-level precision welding.


Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine

 
Packaging & Shipping
All goods packed with wooden case package, vacuum packaging, PE film packing, carton packing and other combinations ,
Ensure that all goods would not be damaged during transportation.
Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine
Related Products

Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine

Company Information:

                                                                                            COMPANY PROFILE
 
Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine
WHY CHOOSE US?

Guangdong Xinling Industrial Co., Ltd. is a high-end brand manufacturer of fully automatic AOI visual inspection equipment, which integrates research and development, manufacturing, sales and service. 
and we are the leading SMT machines and solution with 10 years' experience in China. and we are aslo the only Chinese SMT supplier for ASM factory in China.
Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine

Our advantage

1st,We have strict inspection standards for the quality of our products, which has formed a high-standard process system;

2nd,We have a strong price advantage, absolute price advantage is the best choice for customers;

3rd, our business philosophy: "Customer first, Quality first " Principle;

4th, We are a big international brand level agents and over the years we accumulated a high quality customer resources;

5th, We have a global sourcing, huge demand we can reduce the purchase cost. More new accessories supply to ensure our sustainable supply and price advantage.

Successful Experience:
Xlin's customer in 30 countries around the world
We have been helping customers to build a lot of new factories around the world.
We hope Became the most reliable Chinese partner for you.
Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine

COOPERATION BRAND

Semiconductor High Precision Asmpt Ab383 Fully Automatic Wire Bonding Machine

 
FAQ

1. What products can you provide? 
Placement Machine Feeder, SMT Placement Machine, SMT AOI, SMT SPI, SMT Stencil Printer, SMT Reflow Oven, SMT X-Ray, SMT Feeder, SMT Nozzle, LED Pick & Place Machine, Wave Soldering Machine, SMT Coating Machine, SMT Cleaning Machine, SMT Label Mounter, PCB Cutting Machine, PCB Laser Printer Machine, PCB Handling Machine, SMT Mounter Sales: Placement Machine, Placement Machine Accessories, SMT Accessories.


2. Can I get a sample? what is your MOQ?
Yes, sample is available, our MOQ is 1 piece 


3. How long will it take to deliver the goods?
About 1 to 7 working days. 

4. What kinds of brands of parts can you provide? 
We have Fuji, Juki, Yamaha, Samsung, Panaconic, Siemens, Universal, Hitachi etc.


5. What is the warranty of feeders?
We provide 6 months` warranty on new feeders and 3 months on Second hand Feeders, actual life depends on working and maintanance. If feeder can not work after newly received , free repalcement would be sent immediately or refund
 

After Sales Service

                            24 hrs online, quick response, guaranteed warranty for you :))
                                 For more information, please visit our Official website
                                             
https://gdxinling.en.made-in-china.com 

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