Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder

Product Details
Customization: Available
After-sales Service: Video Technical Support
Condition: New
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  • Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
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Overview

Basic Info.

Model NO.
YSH20
Speed
High Speed
Precision
High Precision
Certification
CCC, PSE, FDA, RoHS, ISO, CE
Warranty
6 Months
Automatic Grade
Automatic
Type
Chip Bonder
Delivery
1-7 Days
MOQ
1 Set
Quality
100% Tested
Adaptation
Flip Chip Mounter
Inventory
Available
Transport Package
Plastic Bag&Carton Box
Specification
1800 KG
Trademark
YAMAHA
Origin
Japan
HS Code
8479896200
Production Capacity
2PCS/Year

Packaging & Delivery

Package Size
145.00cm * 80.00cm * 120.00cm
Package Gross Weight
1200.000kg

Product Description

Product Description
 

The Yamaha YSH20 flip chip placement machine is a high-speed, high-precision placement machine suitable for the placement needs of a variety of components. The following is a detailed introduction to the device:

Basic parameters and performance

Placement speed: high speed, placement capacity reaches 4,500UPH.

Placement accuracy: In high-precision mode, the placement accuracy is ±0.025mm.

Mount component size: ranging from 0.6x0.6mm to 18x18mm.

Power supply specification: 380V.

Applicable component types and mounting capabilities

Mountable component types: including components from 0201 to W55 × L100mm.

Number of component types: The upper limit is 128 types.

Number of nozzles: 18 pieces.

Minimum order quantity: Usually the minimum order quantity is 1 unit.

Shipping place: Shenzhen, Guangdong.

Functions and effects

High-speed placement speed: YSH20 has high-speed placement speed, which is suitable for large-scale production needs and can significantly improve production efficiency.

High-precision placement: This equipment has a high-precision placement function, which can ensure the accuracy of the patch and reduce the scrap rate.

Applicable component range: YSH20 can mount components ranging in size from 0.6x0.6mm to 18x18mm, and is suitable for the mounting needs of a variety of electronic components.

Power supply and air source requirements: The equipment uses a three-phase power supply, and the air source requirement is above 0.5MPa to ensure the stable operation of the equipment in various industrial environments.

Weight and Dimensions: The device weighs approximately 2470kg and is suitable for installation and operation in industrial production environments.

Applicable scenarios

YSH20 is suitable for SMT patch production of various electronic products, especially for industrial production lines that require high-speed and high-precision mounting. Its efficient production capacity and high-precision placement capabilities give it broad application prospects in the electronics manufacturing industry

To sum up, the Yamaha YSH20 flip-chip chip placement machine is suitable for the placement needs of a variety of electronic components due to its high-speed and high-precision characteristics. It is suitable for electronic manufacturing companies that have high requirements for production efficiency and product quality.

 Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder



 

 
Packaging & Shipping
All goods packed with wooden case package, vacuum packaging, PE film packing, carton packing and other combinations ,
Ensure that all goods would not be damaged during transportation.
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
Related Products

Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder

Company Information:

                                                                                            COMPANY PROFILE
 
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
WHY CHOOSE US?
Guangdong Xinling Industrial Co., Ltd. is an innovative technology enterprise whose main business is the full-chain intelligent service of chip mounter equipment. We are based in Shenzhen, the core city of the Guangdong-Hong Kong-Macao Greater Bay Area, and have worked hard for more than ten years. Xinling Industry has always adhered to the development concept of "co-leading with science and technology, co-developing with talents, and creating value for customers" to innovate with technology Based on the foundation, professional team as the core, and high-quality service as the guarantee, we will dig deep into the industry pain points and user needs in the field of global placement machines, and continue to tirelessly explore in more professional market segments and cutting-edge technological innovation fields.
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder


Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder

Our advantage

1st,We have strict inspection standards for the quality of our products, which has formed a high-standard process system;

2nd,We have a strong price advantage, absolute price advantage is the best choice for customers;

3rd, our business philosophy: "Customer first, Quality first " Principle;

4th, We are a big international brand level agents and over the years we accumulated a high quality customer resources;

5th, We have a global sourcing, huge demand we can reduce the purchase cost. More new accessories supply to ensure our sustainable supply and price advantage.

Successful Experience:
Xlin's customer in 30 countries around the world
We have been helping customers to build a lot of new factories around the world.
We hope Became the most reliable Chinese partner for you.
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder

COOPERATION BRAND

Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder

Our Team
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
Semiconductor Packaging Testing Equipment Supplier Manufacturers YAMAHA Ysh20 Flip Chip Mounter Bonder
 

 

FAQ

1. What products can you provide? 
Placement Machine Feeder, SMT Placement Machine, SMT AOI, SMT SPI, SMT Stencil Printer, SMT Reflow Oven, SMT X-Ray, SMT Feeder, SMT Nozzle, LED Pick & Place Machine, Wave Soldering Machine, SMT Coating Machine, SMT Cleaning Machine, SMT Label Mounter, PCB Cutting Machine, PCB Laser Printer Machine, PCB Handling Machine, SMT Mounter Sales: Placement Machine, Placement Machine Accessories, SMT Accessories.


2. Can I get a sample? what is your MOQ?
Yes, sample is available, our MOQ is 1 piece 


3. How long will it take to deliver the goods?
About 1 to 7 working days. 

4. What kinds of brands of parts can you provide? 
We have Fuji, Juki, Yamaha, Samsung, Panaconic, Siemens, Universal, Hitachi etc.


5. What is the warranty of feeders?
We provide 6 months` warranty on new feeders and 3 months on Second hand Feeders, actual life depends on working and maintanance. If feeder can not work after newly received , free repalcement would be sent immediately or refund
 

After Sales Service

                            24 hrs online, quick response, guaranteed warranty for you :))
                                 For more information, please visit our Official website
                                             
https://gdxinling.en.made-in-china.com 

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