| Customization: | Available |
|---|---|
| After-sales Service: | 24 Hrs Online |
| Condition: | New |
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Product Description
Clip auto die bonders are a product of the Mycronic Group, which focuses on providing fully automatic, high-precision, and ultra-flexible die bond systems for a wide range of applications in the optoelectronics industry. ASMPT die bonders have the following key features and benefits:
High Precision and Flexibility: The die bonders offer 1.5 micron die bond accuracy, suitable for high-volume, high-mix production, with exceptional flexibility and reliability. The die bonder can automatically switch between ±0.5 micron and ±1.5 micron accuracy modes, suitable for semiconductor wafer-level packaging, supporting multi-chip, multi-process production.
High Speed and High Efficiency: The die bonders are recognized as industry-leading first-class die bonders for high-speed, high-precision mass production with their leading speed, "zero time" switching between nozzles, and less than 1.5 micron die bond accuracy.
Advanced Technology and Design: The die bonder uses patented dual heads, dual eutectic welding stations, zero-time nozzle conversion system, full air bearing design and other multi-level multi-function parallel process automation to ensure excellent performance. The die bonder uses high-resolution linear encoders and air bearing technology to achieve fast, precise, closed-loop positioning, and the chip placement accuracy reaches +/- 8 microns.
Wide Application Fields: The die bonders are widely used in optical communications and data center devices/modules, microwave and RF devices, high-power lasers, Lidar and AR/VR and other optoelectronic sensors. In addition, it is also suitable for discrete devices, integrated circuits, MEMS and other applications.
Market Performance and User Evaluation: the die bonding has an important position in the global market, and its main competitors include Besi, Yamaha Robotics Holdings, KAIJO corporation and AKIM Corporation. asmpt products have won wide user recognition and market share for their high reliability, high speed and high flexibility.
In summary, the die bonders focuses on providing fully automatic, high-precision, and ultra-flexible die bond systems for a wide range of applications in the optoelectronics industry. the die bonders have the following key features and benefits: an important solution provider for the optoelectronics industry with their high precision, high speed, flexibility, and wide range of applications.
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